Guanghua Shu received his Ph.D. degree in the Department of Electrical and Computer Engineering at University of Illinois at Urbana-Champaign, IL, USA in 2016, M.S. degree in Microelectronics at Fudan University, Shanghai, China, in 2011, and B. Eng. degree from Beijing Jiaotong university, Beijing, China, in 2008. In the summer of 2014, he was a Research Intern in Xilinx, San Jose, CA, developing power and area-efficient parallel link architectures. He worked on 56Gb/s wireline receivers (both electrical and optical) in IBM Thomas J. Watson Research Center, Yorktown Heights, NY, at Mixed-Signal Communication IC Design group in the fall of 2014 and summer of 2015. His research interests are energy-efficient wireline communication systems, clocking circuits, power converters, data converters, and ultralow-power circuits for biomedical applications.
He is a recipient of the Dissertation Completion Fellowship (2015-2016) from University of Illinois and the IEEE SSCS Predoctoral Achievement Award (2014-2015). He serves as a reviewer for IEEE Journal of Solid-State Circuits (JSSC), IEEE Transactions on Circuits and Systems I&II (TCAS-I&II), IEEE Transactions on Very Large Scale Integration Systems (T-VLSI), and International Symposium on Circuits and Systems (ISCAS).